Title:
New Integrated 3D-Circuit Architecture With Spiraling Memory for More Efficient AI
By:
Institute of Industrial Science, The University of Tokyo
Published:
SciTechDaily, 14 June 2020
https://scitechdaily.com/new-integrated-3d-circuit-architecture-with-spiraling-memory-for-more-efficient-ai/
From the article:
Researchers from the Institute of Industrial Science at The University of Tokyo designed and built specialized computer hardware consisting of stacks of memory modules arranged in a 3D-spiral for artificial intelligence (AI) applications. This research may open the way for the next generation of energy-efficient AI devices.